To increase the surface area of the box in contact with open air, a fin design was added to the top of the box. The thermal and physical properties of the air were calculated using analytical methods, taking into consideration the box dimensions, to determine the optimum fin spacing.

Following the determination of the optimum fin spacing, the box design was modified to have a fin height of 30 mm, and the maximum temperature observed on the box was 339 K. It was considered to provide an adequate margin of safety when compared to the maximum operating temperature of the integrated circuits.

The study determined the optimum fin spacing and fin height through analytical and numerical analyses. Taking manufacturing constraints into account, the final design of the box was prepared during this stage.